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AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures good fitting to the elements that require cooling. They do not contain glue.
Application:
- between heat-generating conductors and the heat sink
- filling air gaps between the computer mainboard and the heatsink
- in LED lighting systems
Specifications:
- Manufacturer: AG Thermal Pastes
- Dimensions: 26x25x0.3 mm
- Thermal conductivity: 1.5W/mK
- Quantity: 1
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